Profile of the consultant

Name: Takahisa MASUZAWA

Brief history:

• 1966 Bachelor of Engineering, UT[1]
• 1971 Doctor of Engineering, UT
• 1971-1985 Associate professor, IIS[2], UT
• 1985-2000 Professor, IIS, UT
• 2000-2006 Professor, CIRMM[3], IIS, UT
• 2006-Present, Emeritus Professor, UT
• 2006-Present, Representative, MMTC[4]
  
• 1981.9-1982.8 Visiting Fellow, Eindhoven University of Technology
• 2009.2-2009.3 Honorary Research Fellow, The University of Liverpool

[1] UT: the University of Tokyo
[2] IIS: Institute of Industrial Science
[3] CIRMM: Center for International Research on MicroMechatronics
[4] Masuzawa Micromachining Technology Consulting

R&D experience:

Micro-EDM, Microcutting, Microultrasonic machining, Micro-ECM, Microblanking, Microelectroforming, Microlaser beam machining, Ion beam machining, Microlapping, Microassembly, Measurement of microhole profiles etc.

Patent:

WEDG (Wire ElectroDischarge Grinding), Mate electrode method (Electrochaemical surface finishing), Single dielectric aperture system for ion beam equipment, Vibroscanning Method (Measuring system for inside profile of microholes), Micro-EDM machine etc.

Publication:

• English
• Japanese et al
• HAM

Others:

• Awarded the Commendation by the MEXT[4] as a Person of Scientific and Technological Merits (2003)
• Awarded the JSPE Prize (2009)
• CIRP[5] Emeritus Fellow, Emeritus member of JSEME[6], Emeritus member of JSDMT[7], Emeritus member of JSPE[8]
• Served as: Chaiman of Scientific Technical Committee-E (CIRP), President of JSEME, Board member of JSPE, Board member of JSDMT, Board member of SFSJ[9]

[4] MEXT: Japanese Ministry of Education, Culture, Sports, Science and Technology
[5] CIRP: International Academy of Production Engineering
[6] JSEME: Japan Society of Electrical Machining Engineers
[7] JSDMT: Japanese Society of Die and Mould Technology
[8] JSPE: Japan Society for Precision Engineering
[9] SFSJ: Surface Finishing Society of Japan